Bykski DDR5 Memory Copper Air Cooling Armor (B-MRC-X )

I bought these heatsinks to replace the stock G-skill heatsinks on my Hynix A-die, in addition to a fan pointed at the DIMMs. At 1.4v stock, the DIMMs would hit 69c. After the new heatsinks and fan, the same test at 1.5v hit 52c max. 17c improvement while increasing the voltage significantly.

Finally got around to putting these on, so I figured I'd write a review about them

They're substantial heatsinks, they have some heft. Stock settings after ~1 hour of running these versus what came with my Teamgroup DDR5 C36-7200 2x16 kit, there's a huge difference at stock settings. ~43°c vs ~50°c, though ironically when I removed the Teamgroup heatspreader and ran the dimms naked to test them even that ran cooler than their solution by a few degrees. Get what you pay for I guess

Used (KLE-GSW362) automotive wax remover to take the old heatspreaders off, soaked them for ~45 minutes each and they came right off with the help of a plastic spudger. Not that I'm recommending that: use that or your own solution at your own risk of course

Used the little strips that came with this kit for the memory and controller on the front, and 1.5mm Gelid GP-Ultimate thermal pads cut from a 120x120mm square covering the entirety of the back, excluding the RGB which I have no interest in cooling down

IMO, this is a very good product, well worth their cost if you're planning on trying to eke the most out of your system

Extremely high quality and craftsmanship, very high thermal improvement!!!. One just had to realize they are sold individually, not in pairs. Also works better to use thermal compound TIM, on the memory IC's and a thicker thermal pad behind the IC's to fill in the space, 2mm on the back thermal pad worked perfect for me. Running Gskill 8200 with tight timings, on APEX board, Memory with fan barely breaks 45, before it was into the 60.